- 您现在的位置：买卖IC网 > Sheet目录1198 > B72735D50H62 (EPCOS Inc)CERADIODE ARRAY 5.6VDC 1012
CeraDiodes
High-speed series
2
Soldering guidelines
The use of mild, non-activated fluxes for soldering is recommended, as well as proper cleaning of
the PCB.
The components are suitable for reflow soldering to JEDEC J-STD-020D.
3
3.1
Solder joint profiles / solder quantity
Cement quantity
The component is fixed onto the circuit board with cement prior to soldering. It must still be able
to move slightly. When the board is placed into the reflow oven, excessively rigid fixing can lead
to high forces acting on the component and thus to a break. In addition, too much cement can
lead to unsymmetrical stressing and thus to mechanical fracture of the component. The cement
must also be so soft during mounting that no mechanical stressing occurs.
3.2
Mounting the components on the board
It is best to mount the components on the board before soldering so that one termination does not
enter the oven first and the second termination is soldered subsequently. The ideal case is simul-
taneous wetting of both terminations.
3.3
Solder joint profiles
If the meniscus height is too low, that means the solder quantity is too low, the solder joint may
break, i.e. the component becomes detached from the joint. This problem is sometimes interpret-
ed as leaching of the external terminations.
If the solder meniscus is too high, i.e. the solder quantity is too large, the vise effect may occur.
As the solder cools down, the solder contracts in the direction of the component. If there is too
much solder on the component, it has no leeway to evade the stress and may break, as in a vise.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 13 of 22
发布紧急采购，3分钟左右您将得到回复。
相关PDF资料
B72762A2170S160
VARISTORY ARRAY 17VRMS 0405
BA-2902
2902 ELECTRICALLY CONDUCTIVE ADH
BA-F113SC
F113SC-NON CONDUCTIVE ADHESIVE
BA2-B2-24-610-11A-C3
CIRCUIT BREAKER MAGNETIC 10A
BBRF550S
POLYSWITCH PTC .55A HOLD STRT
BCIM
KIT DESIGN CTLR FOR IPM MODULES
BDH121
HANDLE PISTOL RED/YEL FOR SWITCH
BDZW5
CONVERSION KIT 30A 6POS
相关代理商/技术参数
B72755D0050H062
制造商:EPCOS 制造商全称:EPCOS 功能描述:CeraDiodes
B72755D0050H062_12
制造商:EPCOS 制造商全称:EPCOS 功能描述:High-speed series
B72755D50H62
功能描述:ESD 抑制器 0506 395V 2.2pF CDA3C05GTH
RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C
B72762A2170S160
功能描述:压敏电阻 CA04P2S17TLCG
RoHS:否 制造商:EPCOS 产品:MLV 电压额定值 DC:22 V 电压额定值 AC:17 V 钳位电压:50 V 直径: 峰值浪涌电流:30 A 浪涌能量额定值:75 mJ 电容:74.2 pF 工作温度范围:- 55 C to + 125 C 安装:SMD/SMT 封装:Reel
B72762A8140S160
功能描述:压敏电阻 CA04P2S14THSG
RoHS:否 制造商:EPCOS 产品:MLV 电压额定值 DC:22 V 电压额定值 AC:17 V 钳位电压:50 V 直径: 峰值浪涌电流:30 A 浪涌能量额定值:75 mJ 电容:74.2 pF 工作温度范围:- 55 C to + 125 C 安装:SMD/SMT 封装:Reel
B72762A8140S160_08
制造商:EPCOS 制造商全称:EPCOS 功能描述:Ceramic transient voltage suppressors
B72762A8251V060
制造商:EPCOS 制造商全称:EPCOS 功能描述:Ceramic transient voltage suppressors
B72766A2170S160
制造商:EPCOS 制造商全称:EPCOS 功能描述:Multiple elements in one component